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Setting up a new job in minutes        

Jet printing is a lean technology since it's completely software driven. There is no need for stencils or time consuming operator intervention when setting up a new job. A new job is programmed offline and sent automatically to the machine. With jet printing, you can take a customer's order in the morning and deliver finished boards in the afternoon.

 

Key benefits

  • Import any CAD or Gerber data
  • Prepare a new job off-line, optimizing solder joint quality
  • Quick mode programming – automatch
  • Automatic board alignment
  • Automatic compensation for board stretch and board warpage
  • Automatic bad board mark handling
  • No manual adjustments
  • No support pins required
  • At the machine – just select program and press start

 

Get it right the first time

Thanks to our “what you see is what you get” graphical editor, our data preparation tool enables you to create jet-printing programs with zero errors. Programs are easily fine-tuned off-line, verified and ready to run – before the first board enters the line. Once in the machine, the barcode on the solder paste cartridge and ID chip in the cassette ensure that the right type of paste, within its due date, is used for the right batch.

 

Film Thumbnail - Jet Printing Solution

Optimizing solder joint quality – for each and every solder joint

Each and every solder joint on a board can easily can be optimized, using our graphical drag-and-drop functionality:

  • Solder paste volume
  • Position
  • Height
  • Shape
  • Pad coverage

Quick mode programming – automatch

To get a new job set up as quickly as possible – just use the “automatch”  function. The system will find the pads and, based on their area, automatically create a virtual stencil. The result will be the same paste volume you would achieve by using a stencil, but with a higher repeatability. To achieve perfect solder joints for complex boards, it is recommended to use the ability to optimize each and every solder paste deposit.

Changeovers in no time

Key benefits

  • At the machine – just select program and press start
  • No manual adjustments, no support pins
  • FlowLine – complete automation of the entire production line. Read more...

On-the-spot revisions

Have you ever had a customer call in for a last-minute revision to a board - just when the line is set up and ready to go? And you face the dilemma of tearing down the kitting and starting all over again, ordering a new stencil - or - running the job anyway knowing you will need to do rework on every board.

 

With a jet printer at hand, this is not a problem. Because jet printing enables on-the-spot revisions by simply editing the print program.

 

User friendly operation

Snap-to-machine loading
To maximize uptime, the MY500 solder paste cassette features the ease and speed of “snap-to-machine” loading. When loaded in the machine, an automatic cassette calibration and temperature control ensures that proper solder paste viscosity is maintained for perfect jetting performance. A low paste level warning will alert the operator to plan for refilling solder paste.

 

Easy refilling
No tools are required to refill solder paste or change the paste type. Simply release the snap lock, remove the old cartridge and insert a new one. The electronic ID of the cassette and the barcode label on the paste cartridge makes the machine settings automatic.

Repeatable process – operator independent quality

By working off-line while the machine is running, you can easily fine-tune the volume, height and area coverage of solder paste required for each pad, component or package. Once at the machine, you simply start printing – the operator cannot affect the performance.

No stencils required

Jet printing technology eliminates the need for stencils. You will never again have to wait for a stencil to arrive. As a result, you can always start a new job quickly. Moreover, you can stop wasting valuable time and money with cleaning, storing, retrieving, ordering and hunting down stencils.

 

Switch easily between solder paste and glue

Are you still keeping your old glue dispenser alive - just to glue the occasional double sided through-hole boards? With the MY500 jet printer, you can replace both your screen printer and your old glue dispenser. In a few seconds, the MY500 can switch from jet printing solder paste to start printing glue instead - at ten times the speed of the fastest dispenser.

 

100% yield using Inspect and repair

The key to achieving perfect solder joints for the finest components is to get the optimal shape, position and volume of the paste on the pad. With the 2D Inspect and Repair option, you can automatically verify the most critical solder paste deposits prior to sending the board to the pick-and-place equipment.

 

If the paste deposit was not as expected, you do not have to clean the board and start all over - the system can automatically repair the board.

Clean process – less waste

As the print head is designed as a closed system, all solder paste in a cartridge will be used to build boards. Very little solder paste will be wasted – it's a clean technology for the operator as well as for the environment. Furthermore, the amount of solder paste used on a jetted PCB is reduced compared to a screen printed PCB. When optimizing solder paste volumes for each solder joint on a board, typically 30–50% less solder paste will be used.

Page last changed:  2012-10-17 | Print